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名稱：USB A/F 3.1沉板 H=2.11 H=3.50(過10G)

NOTE:

1.MATERIAL: 

  1.1 INSULATOR:LCP+30%GF, UL94 V-0. 

  1.2 CONTACT 1~4PIN: C5191-EH.

  1.3 CONTACT 5~9PIN: C5191-EH. 

  1.4 SHELL: SUS304 3/4H

2. PLATING: 

  2.1 CONTACT: 

      CONTACT AREA: GOLD PLATING.

      SOLDER AREA: 100u" Min MATTE TIN  PLATING.

      UNDER PLATE: 50u" Min NICKEL PLATING.

  2.2 SHELL:50u" Min. NICKEL PLATED OVERALL 

3. CHARACTERISTICS: 

  3.1 ELECTRICAL CHARACTERISTICS; 

     CONTACTRESISTANCE:30m? MAXIMUM 

     CONTACT CURRENT RATING: 3A 

     DIELECTRIC WITHSTANDING VOLTAGE: 500 V R.M.S. 

     INSULATION RESISTANCE: 100 MEGOHMS MIN 

     OPERATING TEMPEROTURE: -25°C ～ +85°C 

  3.2 MECHANICAL: 

     MATING FORCE: 8N-20N. 

     UNMATING FORCE: 8N-20N. 

4.PART MUST COMPLY ROHS SPECIFICATION

5.WAVE SOLDER:THE CONNECTOR SHALL BE MOUNENTD 

ON THE PCB.THE TEMPERATURE OF THE SOLDER SHALL

BE 260±5 °C AND IMMERSION DURATION 5 SECONDS.